| Goldchip technology trademark of Semiconix Corporation for known good die , flip chip , bare die , wafer foundry for discrete semiconductors, , integrated circuits and integrated passive components manufactured by Semiconix Semiconductor,ZENER DIODES FAIRCHILD CROSS REFERENCE, Fairchild,MM3Z10VB-,MM3Z11VB-,MM3Z12VB-,MM3Z13VB-,MM3Z15VB-,MM3Z16VB-,MM3Z18VB-,MM3Z20VB-,MM3Z22VB-,MM3Z24VB-,MM3Z27VB-,MM3Z2V4B-,MM3Z2V7B-,MM3Z30VB-,MM3Z33VB-,MM3Z36VB-,MM3Z39VB-,MM3Z3V0B-,MM3Z3V3B-,MM3Z3V6B-,MM3Z3V9B-,MM3Z43VB-,MM3Z47VB-,MM3Z4V3B-,MM3Z4V7B-,MM3Z51VB-,MM3Z56VB-,MM3Z5V1B-,MM3Z5V6B-,MM3Z62VB-,MM3Z68VB-,MM3Z6V2B-,MM3Z6V8B-,MM3Z75VB-,MM3Z7V5B-,MM3Z8V2B-,MM3Z9V1B-,BZX84C 10-,BZX84C 11-,BZX84C 12-,BZX84C 13-,BZX84C 15-,BZX84C 16-,BZX84C 18-,BZX84C 20-,BZX84C 22-,BZX84C 24-,BZX84C 27-
ZENER DIODES FAIRCHILD CROSS REFERENCE, Fairchild,MM3Z10VB-,MM3Z11VB-,MM3Z12VB-,MM3Z13VB-,MM3Z15VB-,MM3Z16VB-,MM3Z18VB-,MM3Z20VB-,MM3Z22VB-,MM3Z24VB-,MM3Z27VB-,MM3Z2V4B-,MM3Z2V7B-,MM3Z30VB-,MM3Z33VB-,MM3Z36VB-,MM3Z39VB-,MM3Z3V0B-,MM3Z3V3B-,MM3Z3V6B-,MM3Z3V9B-,MM3Z43VB-,MM3Z47VB-,MM3Z4V3B-,MM3Z4V7B-,MM3Z51VB-,MM3Z56VB-,MM3Z5V1B-,MM3Z5V6B-,MM3Z62VB-,MM3Z68VB-,MM3Z6V2B-,MM3Z6V8B-,MM3Z75VB-,MM3Z7V5B-,MM3Z8V2B-,MM3Z9V1B-,BZX84C 10-,BZX84C 11-,BZX84C 12-,BZX84C 13-,BZX84C 15-,BZX84C 16-,BZX84C 18-,BZX84C 20-,BZX84C 22-,BZX84C 24-,BZX84C 27-
ZENER DIODES FAIRCHILD CROSS REFERENCE, Fairchild,MM3Z10VB-,MM3Z11VB-,MM3Z12VB-,MM3Z13VB-,MM3Z15VB-,MM3Z16VB-,MM3Z18VB-,MM3Z20VB-,MM3Z22VB-,MM3Z24VB-,MM3Z27VB-,MM3Z2V4B-,MM3Z2V7B-,MM3Z30VB-,MM3Z33VB-,MM3Z36VB-,MM3Z39VB-,MM3Z3V0B-,MM3Z3V3B-,MM3Z3V6B-,MM3Z3V9B-,MM3Z43VB-,MM3Z47VB-,MM3Z4V3B-,MM3Z4V7B-,MM3Z51VB-,MM3Z56VB-,MM3Z5V1B-,MM3Z5V6B-,MM3Z62VB-,MM3Z68VB-,MM3Z6V2B-,MM3Z6V8B-,MM3Z75VB-,MM3Z7V5B-,MM3Z8V2B-,MM3Z9V1B-,BZX84C 10-,BZX84C 11-,BZX84C 12-,BZX84C 13-,BZX84C 15-,BZX84C 16-,BZX84C 18-,BZX84C 20-,BZX84C 22-,BZX84C 24-,BZX84C 27-
Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor 
Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete 
components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging 
systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military 
applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber 
optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of 
semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays 
contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET 
s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase 
is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic 
components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, 
high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, 
TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET 
s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE 
Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition 
services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 
20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following 
fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor 
technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete 
and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light 
wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, 
ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining 
by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions 
of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, 
gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL 
designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, 
industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, 
diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated 
termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet 
appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes 
networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. 
Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US 
MICROWAVES develops, manufactures and supplies high 
quality standard microwave thin film circuits and microwave 
devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing 
from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon 
and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, 
MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and 
PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. |